Warehouse of sourced components

Components Sourcing

  • Counterfeit electronics mitigation begins with counterfeit avoidance
  • SMT Corp. sources from our network of 200+ Approved Suppliers
  • 1,400 Restricted Suppliers
Enhanced visual inspection

Enhanced Visual

  • 100% Visual Inspection @ 2.5x – 125x+ magnification in accordance with AS6081/AS6171
  • Detailed visual and dimensions performed on Keyence VHX-7000 Series Digital Microscopes
  • High resolution photography of test samples
X-ray inspection

X-Ray Inspection

  • 100% X-Ray inspection utilizing Nordson Dage Quadra 5 X-Ray Systems w/ micro CT 3D Imaging Capabilities
  • Creative Electron Tru-View Reel to Reel X-Ray system for 100% Automated Inspection
  • Each SMT Corp. electronics inspector is NAS-410 Level 1 Certified
Man using XRF machine


  • X-Ray Fluorescence material analysis of package terminals / leads and body
  • Fischerscope XDAL X-Ray Fluorescence systems
  • Hi-Rel, RoHS, and Lead-Free Analysis
Woman using scanning electron microscope

Scanning Electron Microscopy

  • Tescan Vega3 Scanning Electron Microscopes with secondary and backscatter detectors
  • Up to 500k magnification
  • High resolution imaging for component package analysis
Close up of electronic component
Displaying resistence to heated solvent

Resistance to Solvent and Heated Solvent

  • Mineral Spirit / Alcohol marking permanency
  • Acetone resistance to solvents
  • MIL-STD-883 Resistance to Solvents
  • Dynasolve 750 and N-Methyl-2-pyrrolidone heated solvent per AS6081 and AS6171
Woman testing solderability


  • Gen3 MUST III Force Wetting Solderability per IEC 60068-2-69, J-STD-002, and MIL-STD-883 method 2022
  • Quantitative and repeatable
  • Testing of Leaded and Lead-Free devices
  • Measurements down to 0.001mN
Workers using Nisene JetEtch Pro CuProtect decapsulation systems

Decapsulation / Die Verification

  • Acid etch decapsulation using Nisene JetEtch Pro CuProtect decapsulation systems
  • >90% red fuming nitric acid and sulfuric acid for etching of plastic encapsulated (PEM) devices
  • Die verification supported by SMT Corp.’s vast ‘gold sample’ die image library