Components Sourcing

• Counterfeit electronics mitigation begins with counterfeit avoidance
• SMT Corp. sources from our network of 200+ Approved Suppliers
• 1,400 Restricted Suppliers

Enhanced Visual

• 100% Visual Inspection @ 2.5x – 125x+ magnification in accordance with AS6081/AS6171
• Detailed visual and dimensions performed on Keyence VHX-7000 Series Digital Microscopes
• High resolution photography of test samples

X-Ray Inspection

• 100% X-Ray inspection utilizing Nordson Dage Quadra 5 X-Ray Systems w/ micro CT 3D Imaging Capabilities
• Creative Electron Tru-View Reel to Reel X-Ray system for 100% Automated Inspection
• Each SMT Corp. electronics inspector is NAS-410 Level 1 Certified

XRF

• X-Ray Fluorescence material analysis of package terminals / leads and body
• Fischerscope XDAL X-Ray Fluorescence systems
• Hi-Rel, RoHS, and Lead-Free Analysis

Scanning Electron Microscopy

• Tescan Vega3 Scanning Electron Microscopes with secondary and backscatter detectors
• Up to 500k magnification
• High resolution imaging for component package analysis

Resistance to Solvent and Heated Solvent

• Mineral Spirit / Alcohol marking permanency
• Acetone resistance to solvents
• MIL-STD-883 Resistance to Solvents
• Dynasolve 750 and N-Methyl-2-pyrrolidone heated solvent per AS6081 and AS6171

Solderability

• Gen3 MUST III Force Wetting Solderability per IEC 60068-2-69, J-STD-002, and MIL-STD-883 method 2022
• Quantitative and repeatable
• Testing of Leaded and Lead-Free devices
• Measurements down to 0.001mN

Decapsulation / Die Verification

• Acid etch decapsulation using Nisene JetEtch Pro CuProtect decapsulation systems
• >90% red fuming nitric acid and sulfuric acid for etching of plastic encapsulated (PEM) devices
• Die verification supported by SMT Corp.’s vast ‘gold sample’ die image library

AS6171/8 – RAMAN

• RAMAN Spectroscopy

AS6171/9 – Fourier Transform Infrared Spectroscopy (FTIR)

• Fourier Transform Infrared Spectroscopy