MIL-STD-750 Semiconductor Device Testing

SMT Corp provides electrical testing and upscreening services for multiple standards in accordance with the test and inspection methods of MIL-STD-750.

Standard	Device Type	Screening Levels
MIL-PRF-19500	Packaged Discrete Semiconductors	All Levels Military and Space Grades

A sample list of the test methods that SMT Corp can perform is provided below. 

Please contact SMT Corp for more information or questions about your specific testing and screening requirements.

What is MIL-STD-750?

MIL-STD-750 is a military test standard that establishes uniform test methods for evaluating the electrical, mechanical, and environmental characteristics of semiconductor devices. Developed by the U.S. Department of Defense, the standard provides a framework for assessing the performance, reliability, and durability of discrete semiconductors used in high-reliability applications.

MIL-STD-750 testing helps manufacturers, distributors, and end users verify that semiconductor components can withstand the environmental and operational stresses encountered in aerospace, defense, telecommunications, and other mission-critical systems. The standard includes a wide range of test methods designed to evaluate electrical performance, thermal stability, mechanical integrity, and long-term reliability.

Why MIL-STD-750 Testing Matters

In aerospace and defense applications, semiconductor failure can result in costly downtime, mission disruption, or system failure. MIL-STD-750 testing provides an established methodology for validating the reliability and performance of semiconductor devices before they are deployed in critical environments.

The standard is frequently used to support quality assurance programs, component qualification efforts, and counterfeit risk mitigation strategies. By identifying defects, performance degradation, or nonconforming devices, MIL-STD-750 testing helps organizations reduce supply chain risk and improve confidence in component authenticity and reliability.

For organizations operating under strict military and aerospace requirements, MIL-STD-750 testing serves as an important tool for demonstrating compliance, validating component performance, and supporting long-term operational success.

 

MIL-STD-750 Test Methods & Capabilities

Thermal Cycling TM1051

TM1051 is performed to determine the resistance of a semiconductor device to alternating high and low temperatures extremes.

TM1051 is performed to determine the resistance of a semiconductor device to alternating high and low temperatures extremes.

TM1071 testing is conducted to determine the quality of the hermetic seal for semiconductor devices with designed internal cavities. Fine and Gross leak conditions are both measured.

Particle Impact noise Detection (PIND) Test TM2052

PIND is used to detect loose particles inside a semiconductor device cavity. The test provides a nondestructive means of identifying those devices containing particles of sufficient mass, that upon impact with the case, excite the transducer.

Burn-in TM1038, TM1039, TM1040

Burn-In (TM1038 for diodes, rectifiers, and zeners, TM1039 for transistors, and TM1040 for thyristors (controlled rectifiers)) is a test used to eliminate marginal devices or devices with manufacturing defects that are evidenced as time and stress dependent failures. These defective devices would typically exhibit early lifetime failure under normal operating conditions.

Constant Acceleration TM2006

A TM2006 test is where centrifugal forces (typically 20,000g) are used on a semiconductor device to determine if it exhibits types of structural and mechanical weaknesses not necessarily detected by other mechanical tests.

Lead Integrity TM2005

The TM2005 test is used to determine if axial lead glass body diodes are free of intermittent connections or opens under conditions of tensile stress and controlled temperature.

External Visual TM2068

TM2068 is performed to visually inspect nontransparent glass-encased, double plug, non-cavity, axial leaded or surface mount semiconductor devices for defects which may affect the integrity of the hermetic seal.

Internal and External Visual including Radiography TM2069 – TM2076

TM2069 test method is to verify the construction and quality of workmanship of semiconductor devices in the assembly process to the point of pre-cap inspection.

TM2070 is conducted to verify the construction and quality of workmanship in wafer, wafer dc testing, die inspection, and assembly processes to the point of semiconductor device pre-cap inspection.

TM2071 test method is to verify the workmanship of hermetically packaged semiconductor devices. This method shall also be utilized to inspect for damage due to handling, assembly, and test of the packaged device.

TM2072 is performed to verify the construction and workmanship of bipolar transistors, field effect transistors (FET), discrete monolithic, multichip, and multijunction semiconductor devices excluding microwave and selected RF devices.

TM2073 checks the quality and workmanship of semiconductor die for compliance with the requirements of the individual specification sheet.

TM2074 test is used to verify the internal materials, design, construction, and workmanship of discrete semiconductor diodes and other two-terminal semiconductor devices.

TM2076 test is performed to determine if there are defects within the sealed case of a semiconductor device, especially those resulting from sealing of the lid to the case, and internal defects such as foreign objects, improper interconnecting wires, and voids in the die attach material.

Bond Strength TM2037

TM2037 is performed to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the applicable acquisition document.

Solderability TM2026

TM2026 test method is evaluate the solderability of leads, pads, pins and solder terminals of semiconductor devices that will be assembled using tin-lead eutectic solder.

Decapsulation Internal Inspection TM2075

TM2075 test verifies that design and construction of a semiconductor device are the same as those documented in the qualified design report and for which qualification approval has been granted.

Scanning Electron Microscope (SEM) Inspection TM2077

TM2077 test method provides a means of judging the quality and acceptability of metallization on semiconductor dice. It addresses the specific metallization defects that are batch process oriented, and which can best be identified utilizing this test method.

When is MIL-STD-750 Testing Required?

MIL-STD-750 testing may be required when semiconductor devices are used in aerospace, defense, government, and other high-reliability applications. Testing is commonly performed during component qualification programs, supplier verification activities, failure analysis investigations, and incoming inspection of components sourced through the open market.

Defense contractors and subcontractors operating under DFARS counterfeit electronic parts requirements often incorporate testing standards such as MIL-STD-750 into their risk mitigation and verification processes. Testing may also be specified through customer flowdown requirements, procurement contracts, military specifications, or internal quality management systems designed to ensure component authenticity and performance.

Organizations facing obsolescence challenges, supply shortages, or hard-to-find component sourcing situations frequently utilize MIL-STD-750 testing as an additional layer of validation before components are released for production or field use.

Counterfeit & Open Market Risk Mitigation

Supply chain shortages, obsolescence, and long lead times often force organizations to source semiconductor devices beyond authorized distribution channels. In these situations, additional verification may be required to confirm that components meet performance and reliability requirements.

MIL-STD-750 testing provides objective electrical and environmental data that can help validate semiconductor devices sourced from the open market. When combined with SMT Corp’s inspection, authentication, and AS6171 testing capabilities, MIL-STD-750 testing supports a comprehensive component verification strategy for aerospace, defense, and other high-reliability applications.

MIL-STD-750 Test Methods & Capabilities

SMT Corp performs a variety of MIL-STD-750 test methods designed to evaluate semiconductor device performance and reliability, including:

• Electrical characterization testing
• Leakage current testing
• Breakdown voltage testing
• Thermal resistance testing
• Environmental stress testing
• Temperature cycling
• Burn-in and endurance testing
• Mechanical integrity evaluations
• Failure analysis support

Testing can be tailored to customer specifications, procurement requirements, and application-specific risk profiles.

Related Standards & Compliance Frameworks

MIL-STD-750 testing is often performed alongside other industry-recognized standards and specifications, including:

• MIL-STD-883 testing for microelectronic devices
• MIL-PRF-19500 semiconductor device requirements
• MIL-PRF-38535 integrated circuit qualification requirements
• MIL-PRF-38534 hybrid microcircuit requirements
• MIL-PRF-38544 multichip module requirements
• AS6171 counterfeit detection testing
• DFARS counterfeit electronic parts compliance programs

These standards work together to support component quality, authenticity, and long-term reliability throughout the electronics supply chain.

Counterfeit & Open Market Risk Mitigation

When semiconductor devices are sourced from independent distributors or the open market, additional verification measures are often required to reduce counterfeit risk.

MIL-STD-750 testing can provide valuable performance data that helps identify nonconforming, altered, remarked, or potentially counterfeit semiconductor devices. Combined with visual inspection, authentication services, and AS6171 testing methodologies, MIL-STD-750 testing supports a comprehensive counterfeit mitigation strategy for aerospace, defense, and high-reliability electronics programs.