TM2069 test method is to verify the construction and quality of workmanship of semiconductor devices in the assembly process to the point of pre-cap inspection.
TM2070 is conducted to verify the construction and quality of workmanship in wafer, wafer dc testing, die inspection, and assembly processes to the point of semiconductor device pre-cap inspection.
TM2071 test method is to verify the workmanship of hermetically packaged semiconductor devices. This method shall also be utilized to inspect for damage due to handling, assembly, and test of the packaged device.
TM2072 is performed to verify the construction and workmanship of bipolar transistors, field effect transistors (FET), discrete monolithic, multichip, and multijunction semiconductor devices excluding microwave and selected RF devices.
TM2073 checks the quality and workmanship of semiconductor die for compliance with the requirements of the individual specification sheet.
TM2074 test is used to verify the internal materials, design, construction, and workmanship of discrete semiconductor diodes and other two-terminal semiconductor devices.
TM2076 test is performed to determine if there are defects within the sealed case of a semiconductor device, especially those resulting from sealing of the lid to the case, and internal defects such as foreign objects, improper interconnecting wires, and voids in the die attach material.