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Components Sourcing
- Counterfeit electronics mitigation begins with counterfeit avoidance
- SMT Corp. sources from our network of 200+ Approved Suppliers
- 1,400 Restricted Suppliers
Enhanced Visual
- 100% Visual Inspection @ 2.5x – 125x+ magnification in accordance with AS6081/AS6171
- Detailed visual and dimensions performed on Keyence VHX-7000 Series Digital Microscopes
- High resolution photography of test samples
X-Ray Inspection
- 100% X-Ray inspection utilizing Nordson Dage Quadra 5 X-Ray Systems w/ micro CT 3D Imaging Capabilities
- Creative Electron Tru-View Reel to Reel X-Ray system for 100% Automated Inspection
- Each SMT Corp. electronics inspector is NAS-410 Level 1 Certified
XRF
- X-Ray Fluorescence material analysis of package terminals / leads and body
- Fischerscope XDAL X-Ray Fluorescence systems
- Hi-Rel, RoHS, and Lead-Free Analysis
Scanning Electron Microscopy
- Tescan Vega3 Scanning Electron Microscopes with secondary and backscatter detectors
- Up to 500k magnification
- High resolution imaging for component package analysis
Resistance to Solvent and Heated Solvent
- Mineral Spirit / Alcohol marking permanency
- Acetone resistance to solvents
- MIL-STD-883 Resistance to Solvents
- Dynasolve 750 and N-Methyl-2-pyrrolidone heated solvent per AS6081 and AS6171
Solderability
- Gen3 MUST III Force Wetting Solderability per IEC 60068-2-69, J-STD-002, and MIL-STD-883 method 2022
- Quantitative and repeatable
- Testing of Leaded and Lead-Free devices
- Measurements down to 0.001mN
Decapsulation / Die Verification
- Acid etch decapsulation using Nisene JetEtch Pro CuProtect decapsulation systems
- >90% red fuming nitric acid and sulfuric acid for etching of plastic encapsulated (PEM) devices
- Die verification supported by SMT Corp.’s vast ‘gold sample’ die image library
