A Brief Guide to Electronic Component Test Services

A Brief Guide to Electronic Component Test Services

There is a wide variety of electronic components and electronic component tests. The main types of electronic components are as follows:

Passive Components.  These do not require external power to operate and do not amplify signals.

• Resistors – Control current flow and voltage levels.
• Capacitors – Store and release electrical energy; used for filtering and smoothing.
• Inductors – Store energy in a magnetic field; used in filtering and energy storage.
• Transformers – Transfer electrical energy between circuits via electromagnetic induction.

Active Components.   These require an external power source and can amplify or control electrical signals.

• Diodes – Allow current to flow in one direction only (includes LEDs, Zener diodes).
• Transistors – Switch or amplify electrical signals (e.g., bipolar junction transistors, MOSFETs).
• Integrated Circuits (ICs) – Miniaturized circuits with multiple electronic functions (like microcontrollers, op-amps, and processors).

Electromechanical Components.  These involve both electrical and mechanical processes.

• Switches – Manually or automatically open/close circuits.
• Relays – Electrically operated switches.
• Connectors – Provide connections between different electronic assemblies.
• Fans/Motors – Convert electrical energy into mechanical movement.

For these components, there are many different types of electronic component test services for a range of needs and requirements.   Some of these tests include:

Electronic component functional & performance design verification is the process of testing components to confirm they operate according to their intended functions and meet specified electrical performance parameters. This ensures the component performs reliably under normal and extreme operating conditions, validating both its functionality and compliance with design requirements.

Electronic Component Environmental Stress Screening (ESS) is a process used to expose electronic components to controlled environmental stresses—such as temperature cycling, vibration, and electrical loads—to identify and eliminate early-life failures or latent defects. ESS helps ensure only the most reliable components move forward into critical applications, such as military, aerospace, and medical systems, where long-term performance and durability are essential.

Electronic component Electromagnetic Compatibility (EMC) compliance testing is the process of evaluating components to ensure they do not emit excessive electromagnetic interference (EMI) and are not overly sensitive to external electromagnetic disturbances. EMC testing verifies that electronic components can operate safely and reliably without causing or experiencing unwanted interference, in compliance with industry standards such as MIL-STD-461, FCC, and IEC. This testing is crucial for components used in aerospace, military, medical, and industrial applications where signal integrity and system performance are critical.

Electronic component upscreening is the process of testing commercial-grade or industrial-grade electronic parts beyond their original manufacturer specifications to ensure they meet the higher performance, reliability, and environmental standards required for critical applications such as aerospace, defense, and medical industries. Upscreening helps verify that components can operate under extreme conditions, such as wider temperature ranges, increased vibration, or prolonged stress, making them suitable for use in high-reliability environments where failure is not an option.

Electronic component counterfeit detection testing is the process of inspecting and analyzing electronic parts to identify counterfeit, substandard, or altered components. This testing uses techniques such as visual inspection, X-ray imaging, decapsulation, electrical testing, and material analysis to verify authenticity, ensure the integrity of the supply chain, and protect high-reliability systems—especially in critical industries like aerospace, defense, medical, and automotive.

Electronic component failure analysis is the process of investigating why and how an electronic component has failed. It involves using specialized techniques—such as X-ray inspection, decapsulation, cross-sectioning, and electrical testing—to identify the root cause of failure, whether due to manufacturing defects, environmental stress, design issues, or counterfeit materials. This analysis is essential for improving product reliability, preventing future failures, and supporting quality assurance in critical industries like aerospace, defense, and medical.

Military standard electronic component qualification is a rigorous testing and certification process that ensures components meet strict performance, reliability, and durability standards required for defense, aerospace, and other mission-critical applications. These standards, defined by organizations like MIL-STD and MIL-PRF, verify that components can operate consistently in extreme environments such as high temperatures, vibration, and radiation.

Military standards classify component qualification into various levels based on the required reliability and application criticality. Some common levels include:

Level	Description
JAN (Joint Army-Navy)	Base-level qualification that meets standard military requirements.
JAN-TX	High-reliability components that have passed additional screening for critical aerospace and defense systems.
JAN-TXV	Extra high-reliability level with even stricter screening, typically for space and high-risk applications.
JAN-S	Space-grade qualification, the highest level, with the most extensive testing and environmental screening.
MIL-PRF (Performance Specification)	Defines specific performance criteria for parts, which must be met for qualification under certain military programs.

 

Common Military Testing Services Include:

• MIL-STD-883 / MIL-STD-750
• MIL-PRF Testing such as MIL-PRF-38535, MIL-PRF-38534, and MIL-PRF-19500
• Temperature Cycling (–55°C to +125°C or higher)
• Burn-In Testing
• Hermeticity and Seal Testing (Fine and Gross Leak)
• Destructive Physical Analysis (DPA)
• Counterfeit Detection (X-ray, decapsulation, SEM)
• Solderability, Lead Integrity, & Bond Strength
• Vibration, Shock, Constant Acceleration, and Thermal Stress
• Electrostatic Discharge (ESD) Sensitivity Testing
• PIN-D (Particle Impact Noise Detection)

Companies Providing Military-Grade Electronic Component Testing Services

Company		Key Military Services
Element U.S. Space & Defense (formerly National Test Systems)			EMI Testing, Environmental testing, shock testing, hydraulics, munitions testing.
Integra Technologies		MIL-PRF-38535 screening, life testing, burn-in, radiation testing, reliability analysis
SMT Corp (A Division of Certify Holdings)		MIL-STD testing, design verification, upscreening, environmental stress screening (ESS), burn-in, DPA, counterfeit detection, decapsulation, X-ray
Micross Components		MIL-STD testing, upscreening, environmental stress screening (ESS), burn-in, DPA, counterfeit detection
Advanced Component Testing (ACT)	Electrical testing, MIL-STD-883 testing, decapsulation, X-ray, counterfeit inspection, hermeticity testing
Dayton T. Brown, Inc.		Full MIL-STD environmental testing (shock, vibration, EMI/EMC, temperature extremes)
Criteria Labs		Upscreening, Temperature Testing, Wafer probing