Solderability testing, utilizing wetting balance technology, is a measurement of the weight and speed with which the solder meniscus climbs upwards on the component lead dipped in molten solder. When properly administered Wetting Balance measurement is by far the most accurate, quantitative method for measuring, testing and recording solderability. Although the type of Wetting Balance used for through-hole (TH) and surface-mount (SM) components does differ, both are based on the same physical principals.

SMT Corporation’s in-house solderability testing is for both leaded and lead-free components using Multicore Universal Solderability Testers (MUST). The “MUST SYSTEM 3” from “GEN3 Systems” measures the force of solder on a component’s electrical connector with a resolution accuracy of >0.01mN. Designed to measure a component’s wetting ability or the quality of contact between fluid solder and the component surface, the machine raises a solder module to the component at which point a pulling force is exerted between the solder and the component’s electrical connector. The resulting measurement must reach and maintain specific measured parameters for a component to successfully pass solderability. SMT Corporation performs solderability testing on all open-market sourced product being sold to the Defense & Aerospace industry.

Information Obtained

  • Force (in mN) needed for proper wetting balance
  • Lead (+Pb) and Lead-Free (-Pb) solder testing
  • Graphical report detailing results – (needs to be a link to a solderability report)

The MUST SYSTEM 3 Tests to:

  • IEC 60068-2-69 [-20/-54/-57 Rev]
  • MIL-STD-883 Method 2022
  • IPC/EIA J-STD-003A
  • EIA /JET-7401

Including Edge Dip Test Methods of:

  • IEC 60068-2-20 and 60068-2-58
  • IPC/EIA J-STD-003A