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April 26, 2012
 

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   IMAPS EVENTS
Button Automotive Microelectronics 2012 - Early Registration & Hotel Deadlines TOMORROW: Friday, April 27 (read more...)

Button HiTEC 2012 - Begins May 8; 2 Tabletops Still Available (read more...)

Button Packaging The Next Generation of Nano Devices - Abstracts Due This Tuesday, May 1 (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Indiana Chapter Annual Symposium This Monday, April 30 (read more...)

Bullet San Diego Chapter Lunch & Two Talks at Del Mar Electronics Show on May 2 (read more...)

Bullet Arizona Chapter May 3 Lunch Meeting on Ceramic Packages for LED (read more...)

Bullet New England Chapter's 39th Symposium & Expo - "Mission: Possible" - 2 Weeks Away - May 8! (read more...)

Bullet Metro Chapter May 10 Dinner Meeting on Quilt Packaging (read more...)

Bullet Keystone Chapter May 17 Dinner Meeting at Kulicke & Soffa (read more...)

TJ Green Associates, LLC

Quik-Pak
Master Bond
QSIC
  IMAPS Events (view full Web Calendar)
 

Automotive Microelectronics 2012 - Early Registration & Hotel Deadlines TOMORROW: Friday, April 27    ^ Top
IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging will be held at the Dearborn Inn in Dearborn, Michigan, May 22-24. The early registration and hotel deadlines are TOMORROW, Friday, April 27. Registration fees increase after this date and IMAPS cannot guarantee hotel room availability or pricing after the 27th. To view the technical program, exhibit information, to register, or for other details about the Conference, visit www.imaps.org/automotive.

Automotive electronic content continues to rise in vehicles every year. As content rises, microelectronic packaging will continue to play a larger role, as the automobile industry drives for electronics that are smaller in size, lower in cost, higher in content, and more reliable in harsh environments. This Advanced Technology Workshop (ATW) is focused, solely, on advanced developments in automotive electronic packaging.

Tuesday, May 22

Registration: 7:00 am - 6:30 pm

Continental Breakfast: 7:00 am - 8:00 am

Tabletop Exhibits: 10:00 am - 6:30 pm (During Session Breaks)

Welcome and Introduction: 8:00 - 8:30 am
Workshop Chairs

 

Keynote Presentation: 8:30 am – 9:00 am
Transitioning from FreedomCAR to U.S. DRIVE

Speaker: Laura Marlino, Deputy Director | Oak Ridge National Laboratory
Laura Marlino currently holds the position of Director of Vehicle Electrification Partnerships at Oak Ridge National Laboratory. She has been at the laboratory for 20 years working as both a Research Staff Engineer and in Program Management. As part of her current duties she manages the technical aspects of the Power Electronics and Electric Machinery efforts for the Department of Energy’s USDRIVE efforts. Her responsibilities include developing and overseeing projects consistent with DOE’s mission and objectives for hybrid, plug in hybrid and fuel cell vehicle technology development. Ms Marlino received her BS in electronics engineering from the University of New Mexico in Albuquerque, New Mexico and her MSEE from the University of Tennessee in Knoxville, Tennessee. During her engineering career she has been employed with Teledyne Camera Systems in California doing analog video design and Honeywell Aerospace and Marine in New Mexico as both a test and design engineer involved with cockpit displays and processors for military aircraft. She also has worked as a front end IC design engineer with ASIC International in Oak Ridge, Tennessee. For the past ten years she has been heavily involved performing program and project management duties under DOEs Office of Vehicle Technologies Program. She is also a member of the Electrical and Electronics Technical Team within the United States Council for Automotive Research. She currently holds multiple patents and has authored numerous technical publications.


Keynote - Grosu

Keynote Presentation: 9:00 am – 9:30 am
Thermal Challenges and Solutions in GM's Hybrid and Electrical Advanced Propulsion Systems

Speaker: Vicentiu Grosu, Sr. Project Engineer | General Motors
Vicentiu Grosu is a Senior Project Engineer at the Advanced Technology Center of General Motors in Torrance, CA. In 2005, he earned a PhD degree in the Department of Mechanical Engineering from Southern Methodist University, Dallas, TX. After graduation, he worked for 2 years for Schneider Electric as Senior MEMS design engineer developing MEMS devices for automotives and medical applications. For the past 4 years, he had been employed by General Motors and worked on design and analysis of the next generation of power electronics and electrical motors. He participated as a presenter in various conferences and workshops and his work is published in several scientific journals. While working at GM he was involved in 2 patents.

Break in Exhibits Area: 9:30 am – 10:00 am

Session 1: Thermal Reliability
Session Chair: Guangyin Lei, Ford Motor Company

10:00 am - Noon

Power Module Reliability Requirement for Automotive Application
Guangyin Lei, Ford Motor Company

Reliability Concerns - Pitfalls and Issues (and How to Avoid them) 
Tina Barcley, TAS Consulting   

Efficient Cooling of High Density Power Module Solutions for Automotive Applications
Siegbert Haumann, Danfoss Silicon Power GmbH ( Klaus Olesen, Jorgen Holst, Danfoss A/S)

Classifying and Understanding Thermal Interface Materials for Automotive Applications
David Saums, DS&A LLC

Lunch Break, Keynote Presentation & Exhibits: 12:00 pm - 1:15 pm

Keynote - Sharpe

Keynote Presentation:
Counterfeiters' Techniques are Constantly Improving to Avoid Detection - Our National Security and the Well-Being of the US Industrial Base is Dependent on Us to Keep Up With Them

Speaker: Tom Sharpe, Vice President | SMT Corporation
Tom Sharpe is the Vice President of SMT Corporation located in Sandy Hook Connecticut. SMT is an Independent Stocking Distributor of electronic components to the Defense and Aerospace industry and is a recognized leader among Independent Distribution in cutting-edge anti-counterfeit inspection technologies. Tom serves on multiple government & law enforcement anti-counterfeit task force committees as well as the Aerospace Industry Association’s Counterfeit Parts IPT. He is a member of SAE International’s G-19 committee that is currently developing the new Independent Distributor AS6081 certification standard. In addition to being a long-time member of ERAI, Tom has served 2 terms as Vice President of IDEA where he has served continuously on the Board of Directors since the year of its formation in 2003. In November of 2011 Tom provided key testimony before the Senate Armed Services Committee during their formal investigation into the counterfeit threat from China into DoD & the US Industrial supply chains. Tom is active both nationally and internationally on the Electronics Industry speaking tour and has become a leading voice from the Independent sector in the fight against counterfeit components in the electronics industry. Tom’s presentations serve to educate all sectors of the electronics industry about the growing dangers of counterfeits in today’s market, and best practices to detect and mitigate those dangers.

Session 2: Die Attach
Session Chair: Andy Mackie, Indium Corporation
1:15 pm – 5:15 pm

Advances in Pressure-less Sintering for High Temperature Electronic Applications
Paul Gleeson, Henkel Electronics (Jenny England, Richard Kuder, Julissa Eckenrode, Javier Gutierrez)

Thermal Performance and Reliability of Bonded Interfaces
Douglas DeVoto, National Renewable Energy Laboratory (Sreekant Narumanchi, Mark Mihalic)

Lead-free Nanosilver Die-attach Material for Making High-temperature Double-side Cooled Power Modules
G-Q. Lu, Virginia Tech (L. Jiang, D. Berry, H. Zheng, C. Xiao, K. Ngo, Virginia Tech; G. Lei, Ford Motor Company; S. Luo, NBE Technologies)

Break in Exhibits Area: 2:45 pm - 3:15 pm

Advanced Bonding Technology for High Temperature Operational Electrified Vehicles
Sang Won Yoon, Toyota Research Institute of North America

IGBT's from the Top Down; Electrical & Thermal Connectivity from Die Attach to Heat Sink
Mario Scalzo, Indium Corporation

Thermal Cycle Resistant Lead Free Alloys
Derek Daily, Senju Comtek Corp (Satoru Akita, Rafael Padilla, Masato Shimamura, Tokoru Yamaki)

Flux Free Die Attach Utilizing Pressure Variation to Achieve Void Free Results
Bruce Wilson, SST International (Paul Barnes)

Exhibit Hall Reception: 5:15 pm - 6:30 pm


Wednesday, May 23

Registration: 7:00 am – 5:15 pm

Continental Breakfast: 7:00 am - 8:00 am

Tabletop Exhibits: 10:00 am - 5:15 pm (During Session Breaks)

Session 3: Wirebonding and Interconnects
Session Chair: Mike McKeown, Materion Technical Materials
8:00 am - Noon

Physics of Failure of Ribbon Bonds
Douglas DeVoto, National Renewable Energy Laboratory (Mark Mihalic)

Meeting the Challenges of High Reliability for ICs with Thin Pad Al
Stevan Hunter, ON Semiconductor

How to Double CPK in Wirebonding by Just Doing It Right
Josef Sedlmair, F&K Delvotec Semiconductor

Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications
Lee Levine, Hesse & Knipps (Joe Bubel)

Break in Exhibits Area: 10:00 am - 10:30 am

Leveraging Solderless Press-Fit Interconnects in Automotive Micro Electronic Power Modules and Power Applications to Improve Assembly Efficiency and Design Flexibility
Joseph Lynch, Interplex Engineered Products (Jeff Parrish)

A Very Large Area Wirebonder for Bonding Battery Modules in a Single Pass
Josef Sedlmair, F&K Delvotec Bondtechnik (Farhad Farassat)

Aluminum Inlay Design Requirements for Automotive Electronics Leadframes
Mike McKeown, Materion Technical Materials

Lunch Break, Keynote Presentation & Exhibits: 12:00 pm - 1:15 pm

Keynote Presentation:
Qualification of Semiconductor and Passive Device Packages to Automotive Environments

Speaker: Bob Knoell, Quality Manager - Americas
NXP Semiconductors and AEC Coordinator
BIO TBD. 

Session 4: Ceramic Substrates
Session Chair: Ray Fairchild, Delphi Electronics & Safety
1:15 pm - 5:15 pm

Silicon Nitride Substrates for Power Electronics
Manfred Goetz, Rogers Corporation (Bernd Lehmeier, Nico Kuhn, Andreas Meyer, Curamik Electronics GmbH)

Examination and Comparison of Pb-free Thick Film Products for Automotive Applications
Mark Challingsworth, Heraeus Precious Metals North America Conshohocken, LLC (Christina Modes, Jochen Langer)

High Frequency (77 GHz) MMIC Die Stabilization on Organic Substrates
David Ihms, Delphi Electronics & Safety (David Zimmerman)

Characterization of Fuel Resistant Fluorosilicones
Vincent Malave, NuSil Technology LLC (Michelle Velderrain)

Break in Exhibits Area: 3:15 pm - 3:45 pm

Development of New Adhesion Test Methodology for Harsh Environment Microelectronics Applications
Lyndon Larson, Dow Corning

Silicone Multifunctional Potting & Encapsulation for ICE and Electrified Automotive Electronic Module Applications
E. Stanley Jang, Momentive Performance Materials

Cooling from Down Under - Thermally Conductive Underfill
Larry Wang, LORD Corporation (Paul Hough)


Thursday, May 24

Registration: 7:00 am – 11:00 am

Continental Breakfast: 7:00 am - 8:00 am

Session 5: Packaging and Processing
Session Chair: Guangyin Lei, Ford Motor Company
8:00 am - 10:45 am

Integrated Passive Devices into Silicon for New Automotive Challenges
Guillaume Raimbault, IPDiA (Charlotte Jennequin)

LightForm - Laminated LED Lighting
Tim Brooks, Grote Industries

Plastics for MEMS and Sensors in Automotive
Tamim Peter Sidiki, DSM Engineering Plastics B.V. (Jimmy Kong, Paul Potters, Siang-Hock Quah, Hiromi Iribe, Jason Lee, Greg Costantino)

Break in Foyer: 9:30 am - 9:45 am

Low Pressure Molding
Lawrence Butts, BGM Engineering (Scott Lowes, Lighthouse Molding)

RoHS impact on Advanced Interconnects in Automotive
Tamim P. Sidiki, DSM Engineering Plastics B.V. (Rui Zhang, Marco Moll, Jacques Loosdrecht, Ian White, Greg Costantino)

Closing Remarks: 10:45 am - 11:00 am

HiTEC 2012 - Begins May 8; 2 Tabletops Still Available   ^ Top
IMAPS International Conference on High Temperature Electronics (HiTEC 2012) begins in less than two weeks. The Conference will be held in Albuquerque, New Mexico, on May 8-10, 2012. Only 2 tabletops remain - reserve today. To view the technical program, exhibit information, to register, or for other details about the Conference, visit www.imaps.org/hitec.

The members of the Conference Committee are pleased to invite you to the IMAPS High Temperature Electronics Conference (HiTEC 2012). This is the premier event addressing the needs of the high temperature (>150C) electronics community. Applications for high temperature electronics include smart energy, underhood automotive, oil well logging, geothermal, more electric aircraft, space, industrial sensors, etc. HiTEC 2012 provides a comprehensive technical program addressing the applications, and the latest development in devices, circuits, MEMS, sensors, packaging, power sources, and materials to meet the challenges of these applications. Tabletop exhibits will compliment the technical program by providing you an opportunity to view the latest products for high temperature electronics. Luncheons and breaks provide you the opportunity to network and establish valuable contacts in the high temperature electronic community. This is a truly unique opportunity for suppliers, fabricators, and users to meet and talk about the needs, issues and opportunities in this exciting and important technology.

Please join us in Albuquerque, New Mexico for HiTEC 2012.

General Co-Chairs:
Wayne Johnson, Auburn University
Colin Johnston, Oxford Applied Technology – UK
.

Register On-Line | Registration Fees
Technical Program | Tabletop Exhibit Information

Packaging The Next Generation of Nano Devices - Abstracts Due This Tuesday, May 1    ^ Top
IMAPS is pleased to announced the first Advanced Technology Workshop and Tabletop Exhibits on Packaging the Next Generation of Nano Devices which will be held June 14-15, at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York 12203. Workshop details and abstract submission can be found online at www.imaps.org/nano. Abstracts are due: May 1, 2012.

Workshop Focus:
The International Microelectronics And Packaging Society (IMAPS) is organizing an Advanced Technology Workshop and Tabletop Exhibition on “Packaging the Next Generation of Nano Devices” to be held June 14th and June 15th, in Albany, New York.

Overview: With each new generation of high density devices, the packaging community faces ever more difficult challenges. Diverse technologies such as: 3D, 2.5D, silicon carrier, MEMs, Hybrid electro-opto packages, etc require different packaging technologies, different materials, different processing, testing etc. All these variables are the focus of this conference which will be held in the heart of New York State's premier silicon device fabrication center. We hope that you will come and join us to see the progress of the industry and see where it is headed.

Abstracts being requested include the following topics:

  • Wafer thickness, TTV, bow, and warp metrology
  • High-aspect ratio TSV diameter, depth and profile measurements
  • Cu void detection in TSV’s
  • Wafer bond quality - void detection
  • Scanning Acoustic Microscopy
  • X-ray tomography and imaging
  • Via stress measurements
  • Infrared microscopy
  • Bonded wafer pair overlay metrology
  • Detecting defects at bonded wafer pair interfaces
  • TSV interconnect, defects, processing
  • Wafer edge defects
  • Confocal microscopy techniques
  • Bonder force uniformity measurement
  • Post bond strength measurements
  • Electrical test
  • 3D interconnect reliability
  • Optical microscopy
  • Infratometry
  • Die package metrology – voids in underfill, delamination, bonding connectivity
  • Bump coplanarity
  • FIB and plasma FIB; wafer contamination
  • 3D packaging advances
  • Novel packaging techniques
  • Advance materials
  • Novel metrology techniques

Those wishing to make a presentation at the Workshop, please submit a 250-300 word abstract electronically by May 1, 2012, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Brian Schieman (bschieman@imaps.org) or call 202-548-8715.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

No formal technical paper is required.  A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check. The selected student must attend the event to present his or her work and receive the award.

 

  Chapter Activities (events listed in chronological order)
 

Indiana Chapter Annual Symposium This Monday, April 30    ^ Top

Date: April 30, 2012
Location:

Clarion Waterfront Plaza Hotel and Conference Center
2930 Waterfront Parkway West Drive, Indianapolis, IN

Details:

12:00 – 6:30 pm On-site Registration
1:00 – 5:00 pm Technical Presentations
5:00 – 6:30 pm Vendor Displays

No advance registration is required. The event is open and free to all in the industry. Refreshments and raffle prizes will be at 6:00 (must be present to win).

For more event information, please contact Larry Wallman at lwallman@sbcglobal.net or Ray Fairchild at m.ray.fairchild@delphi.com.

Exhibitors:

Vendors (as of April 16):

Foresite, Heraeus, Hi-Tek Sales, Micro Screen, Specialty Coating Systems, and Tropical Stencil

Featuring great technical topics applicable to current electronics component and packaging issues in your work. The eight talented presenters and vendors will share a wealth of excellent experience and data. Technical Presentation Schedule, As of April 4:

San Diego Chapter Lunch & Two Talks at Del Mar Electronics Show on May 2    ^ Top

Date: May 2, 2012
Details:

Del Mar Fair Grounds
Room D (adjacent to the Mexican Plaza in the Mission Towers or Paddock Lounge) 2260 Jimmy Durante Blvd. Del Mar, California 92014

Details:

Lunch and networking @ 12:00 noon.
Presentations at 12:30 & 1:00.

Free parking and general admission to the show, lunch is complimentary for active IMAPS and ACERS members. To register, please contact Dave Virissimo of Semiconductor Packaging Materials at dvirissimo@sempck.com or 619-464-5430.

Del Mar Electronics and Design Show

Presenter 1: 12:30 PM

“Why aren’t you building your products in San Diego?”
Presented by Ted Fogliani

Understanding total cost of local manufacturing versus offshore services. Understanding the global cost comparison. Why often times it is better to use local contracting services.

Presenter Bio: Ted Fogliani serves as CEO of Outsource Manufacturing, Inc. – Made In San Diego, an electronics manufacturing services company which he founded in 1997. Outsource Manufacturing, Inc. has grown into one of San Diego’s leading manufacturing companies. It is the largest privately-held contract manufacturing firm in San Diego which builds solely in the U.S. His company supports many San Diego companies by providing them with high quality manufacturing services and by being an integral part of their supply chain.

Presenter 2: 1:00 PM

“0-400º C in 1/4 of a second.”
Presented by Frank Polese

Understanding the world’s highest power densities of the custom high AlN technology resulting in rapid heating with extreme temperature uniformity. Because of the strength, multilayer co-fired process, and the co-efficient of thermal expansion match of two main materials, the result is a very reliable and compliant system. This system is so robust that there is one application where a customer transitions 200 degrees C every 30 seconds and the heater has passed over a million cycles without failure.

Presenter Bio: Frank Polese is the founder of Oasis Materials which manufactures the world's highest performance heaters using multi-layer, co-fired aluminum nitride with internal tungsten metallization. Oasis is fast becoming a key player in the industrial, commercial and specialty heater markets. Prior to that in 1991, Frank founded Polese Company, a supplier of refractory composite materials which he sold to Plansee of Austria.

Arizona Chapter May 3 Lunch Meeting on Ceramic Packages for LED    ^ Top

Date: May 3, 2012
Location:

Dobson Ranch Inn, Mesa AZ
Click here for directions

Details:

Luncheon and presentations - $20.00 in advance for members
$25.00 in advance for non-members
$30 at door.

Registration and exhibits will open at  11:30
Lunch and Presentation from noon to 1pm
Exhibits close at 1:30  

Exhibitors:

Exhibit with us!
Exhibit at any of our AZ luncheons for $100
Includes:
 - 6ft Tabletop for your display
 - Company promotion via links from our invitations and the AZ Chapter website to your company website
 -lunch for one attendee

If you'd like to exhibit, please contact jody@e-reachcomm.com

Ceramic Packages for LED

Presented by:
Nobuyuki Fukabori, Manager of New Business Development for Asia Ceramic Product Sales, Kyocera America, Inc

The evolution of LED chips and diversified applications brings continuous challenges to LED and Module manufacturers such as thermal management, optical reflection and size reduction requiring a good balance between performance and cost. Thus, the selection of LED package technology becomes a very critical factor to LED product development. This presentation will cover the latest Ceramic Package Technologies for LEDs both in special lighting and general lighting such as headlights for Automotive and LED Bulbs.

About Our Speaker
Nobuyuki Fukabori - Manager New Business Development - Kyocera Nobuyuki Fukabori became manager of New Business Development for Asia Ceramic Product at Kyocera America in June 2010. Nobu has been with Kyocera Corporation (Japan) for more than 30 years in Sales and Business Development for Kyocera's Semiconductor Package Group including previous sales experiences in U.S. from 1990 - 1998. Nobu has a BC (Commerce) from Meiji University, Japan.

New England Chapter's 39th Symposium & Expo - "Mission: Possible" - 2 Weeks Away - May 8!    ^ Top

IMAPS NEW ENGLAND
39th Symposium & Expo
“MISSION: POSSIBLE”
Problems Self-Destruct in 5 Seconds...

Tuesday May 8, 2012
The Largest Regional Microelectronics Symposium
8 Sessions with 42 Speakers

Keynote Address “MISSION: POSSIBLE”
by Dr. Samuel Kounaves, Professor & Research Director
Planetary Chemical Analysis Group - Tufts University 
Research Affiliate, NASA-Jet Propulsion Laboratory

HOLIDAY INN BOXBOROUGH WOODS CONFERENCE CENTER
Boxborough, Massachusetts

Exhibit Booths are still available!
Click for Exhibitor Registration
Click for Sponsor Registration
Click for Attendee Pre-Registration

Featuring

  • Keynote Address “MISSION: POSSIBLE” by Dr. Sam Kounaves, Research Affiliate, NASA Jet Propulsion Laboratory
  • Expanded Technical Program: 8 Sessions with 42 Speakers & Full Poster Session – Click for Full Program
  • Student Paper & Poster Competition with Cash Prizes
  • Microwave Packaging Technology, May 9-11 - TJ Green in Cooperation with iMAPS New England – Click for Details
  • Again for 2012 “Big Red’s Marketplace” An Incubator Area of Table Top Spaces for FIRST TIME EXHIBITORS
  • Fully Carpeted Exhibit Hall with Sixty 8’x10’ Booths - Click for Exhibitor Registration
  • 39th Annual Symposium - "MISSION: POSSIBLE" Theme
  • Employment Center – Submit Opportunities or Bring Résumés, Contact: John Blum - jbblum1@gmail.com
  • Special Symposium Hotel Rate at Holiday Inn – Click to Register On-Line  [Group Code “MAP”] - or call 978-263-8701
  • Numerous Sponsorship Opportunities – Click for Sponsor Registration
  • Loads of Fun, Games and Raffle Prizes…!!!

For Full Program and Exhibitor/Attendee Information:
http://imapsne.org/SymposiumExpo.html
For Exhibitor, Sponsor or General Information:
Harvey Smith 508-699-4767 HarveyS@imapsne.org

Metro Chapter May 10 Dinner Meeting on Quilt Packaging    ^ Top

Date: May 10, 2012
Location:

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
631-585-9500

Details:

Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Presentation: 7:15-8:15 PM

Registration:

Price: Members: $30.00 if Pre-Registered by May 7, 2012
$50.00 after May 7, 2012

Non-Members: $50.00 if Pre-Registered by May 7, 2012
$75.00 After May 7, 2012

Student Members: Free if Pre-Registered by May 7, 2012
$25.00 after May 7, 2012

Due to the anticipated large turnout, we will be giving preference to members. Please provide your membership number when registering. If you wish to join membership information is available at www.imaps.org

Registration Email: metroimaps@optonline.net
Phone: Steve Lehnert (650) 644-5218

There are a limited number of vendor tables available for this event. Please contact Steve Lehnert for further details.

Quilt Packaging (TM) - Ultrahigh Performance Chip-to-Chip Interconnects

Presented by:
Jason M. Kulick
President, Co-Founder, Indiana Integrated Circuits, LLC:

Keystone Chapter May 17 Dinner Meeting at Kulicke & Soffa    ^ Top

Date: May 17, 2012
Location:

Kulicke & Soffa Industries
1005 Virginia Drive
Fort Washington, PA 19034
215-784-6000

Details:

6:00 Registration
6:15 Pizza Dinner (a brief chapter business meeting will be held)
6:45 Presentations Begin

Registration:

Advance registration (before Monday, May14th) is $20.
On-site registration is $25.
Checks and cash (exact change) are appreciated.
Student registration is complimentary with school ID.

Please register in advance with Greg Chesmar at GregChes@aol.com or 215-822-0510. E-mail preferred – please provide name and company affiliation.

Program:

6:00     Registration

6:15     Pizza Dinner (a brief chapter business meeting will be held)

6:45     “Current State of Copper Wire Bonding.”
      Gary Gillotti, Principle Process Engineer at Kulicke and Soffa Industries, Inc.

During the past two years, copper wire bonding has entered high volume manufacturing at a number of leading edge OSAT’s and IDM’s.  Copper wire use has achieved 20% market share and is expected to exceed 50% within three years.  Products spanning the range from low pin count devices with relatively large wire diameter to FPGA’s with nearly one thousand wires at 20 µm or even 18 µm wire are now using copper wire.  Copper wire bonding has seen advancements in many aspects: materials, bonding tools, wire bonder, process optimization methods, bond quality metrics, and metrology and manufacturing consistency.  The presentation will highlight the significant advances in each of these areas. 

Presenter Bio:

Gary Gillotti is a Principle Process Engineer at Kulicke and Soffa.  He has been working for the company in the Ball Bonder Development Group for 32 years.  His current responsibilities are to create copper wire bonding solutions specifically where die to die bonding requires stand-off stitch bonding aka “SSB”.  Prior to his current tasks, Gary was involved in creating the inert gas environment feature to prevent the unwanted copper wire oxidation during wire bonding.  He received a B.S. in Computer Science from Arcadia University in Glenside, PA.
 

7:15    LED Packaging Technology
      Horst Clauberg, Senior Principal Process Engineer at Kulicke and Soffa Industries, Inc.

High brightness LEDs are being adopted in an ever increasing number of applications and use a great variety of packages.  The largest use of high brightness LEDs currently are for back light units on computer monitors and smart phones.  LEDs are beginning to be used for general lighting which is expected to be the major market driver for the next several years.  The presentation will review the current market trends, the package designs for these markets, and the technologies being used to form the package interconnects.
 
Presenter Bio:

Horst Clauberg has been with Kulicke & Soffa for 11 years.  He is a Senior Principal Process Engineer in the Ball Bonder Process R&D Group.   His current focus is on the development of copper wire bonding with an emphasis on reliability.  Previous assignments with K&S have been in Corporate R&D, Wafer Test, and Dicing Blades Divisions.  Before joining K&S, Horst worked in Polymers R&D at Eastman Chemical Co.  He earned his Ph.D. in Physical Chemistry from Harvard University in 1992 and was a post-doctoral fellow at the University of California, Berkeley.

LORD Corporation

RGL Enterprises

EPP

Crane AE Banner

High Temperature Electronics (HiTEC)
May 8-10, 2012
Albuquerque, NM
*Exhibitors contact bschieman@imaps.org

Automotive Microelectronics 2012
May 22-23, 2012

Dearborn, MI

Packaging the Next Generation of Nano Devices
June 14-15, 2012
Albany, NY
*Exhibitors contact bschieman@imaps.org

IMAPS 2012 (San Diego)
September 9-13, 2012
San Diego, CA
*Exhibitors contact bschieman@imaps.org

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